How <15μS/cm Water Improves Plating Qality
How <15μS/cm Water Improves Plating Qality
Why <15μS/cm Water is Critical for Electroplating
✔ Enhances surface finish - Reduces defects by 60%
✔ Improves plating adhesion - For durable coatings
✔ Prevents contamination - Extends bath life
✔ Meets industry standards - ASTM B322 compliant
Industry Fact: Proper water treatment reduces reject rates by 45% in zinc plating
3 System Configurations
1. Basic RO System (10-15μS/cm)
• For: General plating baths
• Capacity: 0.25-100 m³/h
• Recovery: 65-75%
2. RO + Mixed Bed (1-5μS/cm)
• For: Precision plating
• Feature: Automatic regeneration
3. RO + EDI (0.1-1μS/cm)
• For: High-end applications
• Advantage: Chemical-free operation
Technical Specifications
| Parameter | Specification |
|---|---|
| Conductivity | <15μS/cm |
| Flow Range | 0.25-100 m³/h |
| Materials | PVC/FRP/316L |
| Membranes | Dow/Filmtec/Hydranautics |
4 Competitive Advantages
✔ Smart IoT controls - Remote monitoring
✔ Military-grade filters - 5x longer lifespan
✔ 0.18% failure rate - Industry's lowest
✔ 10 patents - Innovative designs
Case Study: Improved nickel plating uniformity by 38%
Industry Applications
1. Decorative Plating
• Jewelry
• Automotive trim
2. Functional Plating
• PCB manufacturing
• Connector plating
3. Metal Finishing
• Anodizing
• Electropolishing
Maintenance Protocol
✅ Daily: Conductivity checks
✅ Weekly: SDI testing
✅ Monthly: CIP cleaning
✅ Quarterly: Resin replacement
✅ Annually: Full validation
Pro Tip: Monitor TDS weekly to optimize bath performance
Free Resources:
📥 Get: "Plating Water Standards Guide"
📞 Get: "Free Water Analysis"
Why Choose Us?
✔ 2000m² R&D center
✔ 300+ technical staff
✔ 10,000+ installed systems
✔ Complete validation support
