- Qingqingquan
- Shandong
- 20 days
- 300 units per month
Semiconductor ultra pure water systems delivering 18 MΩ.cm quality. Advanced RO+EDI+polishing technology for wafer fabrication and chip manufacturing. SEMI standards compliant solutions.
Semiconductor Ultra Pure Water Systems | 18 MΩ.cm EDI & RO Water Plants
Intro: Meet semiconductor manufacturing standards with our ultra pure water systems. Achieve consistent 18 MΩ.cm water quality using advanced RO+EDI+polishing mixed bed technology. Certified solutions for wafer production and chip manufacturing.
Why Ultra Pure Water Matters in Semiconductor Manufacturing
Ultra pure water (UPW) is the lifeblood of semiconductor fabrication facilities. Even minute impurities can cause:
Critical Risks of Impure Water:
- Circuit Defects: Particle contamination on wafers
- Yield Reduction: Decreased production efficiency
- Equipment Damage: Scaling and corrosion in sensitive tools
- Product Failure: Ionic contamination affecting chip performance
Water Quality Standards:
- Resistivity: ≥18 MΩ.cm at 25°C
- Particle Count: <5 particles/ml (>0.1μm)
- TOC Level: <1 ppb
- Silica Content: <0.5 ppb

5 Advanced Process Configurations
1. Traditional RO + Mixed Bed System
- Process Flow: Pretreatment → RO → Mixed Bed → Polishing → UV → Filtration
- Final Quality: ≥18 MΩ.cm
- Best For: High-purity requirements with chemical regeneration
- Key Features: Proven reliability, chemical regeneration
2. Advanced RO + EDI Technology
- Process Flow: Pretreatment → RO → EDI → Polishing → UV → 0.2μm Filtration
- Final Quality: ≥18 MΩ.cm
- Best For: Continuous chemical-free operation
- Key Features: No chemicals, continuous production
3. Double Pass RO + EDI System
- Process Flow: Pretreatment → Primary RO → Secondary RO → EDI → UV → 0.2μm Filtration
- Final Quality: ≥17 MΩ.cm
- Best For: High-recovery applications
- Key Features: Positively charged RO membranes, pH adjustment
4. Compact EDI System
- Process Flow: Pretreatment → RO → EDI → UV → 0.2μm Filtration
- Final Quality: ≥15 MΩ.cm
- Best For: Space-constrained facilities
- Key Features: Compact design, lower capital cost
5. Hybrid Mixed Bed System
- Process Flow: Pretreatment → RO → Mixed Bed → UV → Filtration
- Final Quality: ≥15 MΩ.cm
- Best For: Budget-conscious projects
- Key Features: Cost-effective, reliable performance

Technical Specifications
| Parameter | Specification |
|---|---|
| Output Quality | 15-18 MΩ.cm |
| TOC Level | <1 ppb |
| Particle Count | <5 particles/ml (>0.1μm) |
| Silica Content | <0.5 ppb |
| Bacteria Count | <1 CFU/100ml |
| System Capacity | 1-100 m³/h |
Core System Components
1. Advanced Pretreatment
- Multi-media filtration
- Activated carbon adsorption
- Ultrafiltration systems
- Chemical dosing control
2. Reverse Osmosis Systems
- Double pass RO configuration
- High-rejection membranes
- Energy recovery devices
- Automatic flushing systems
3. EDI Electrodeionization
- Continuous demineralization
- Chemical-free operation
- Stable resistivity output
- Low operating costs
4. Final Polishing
- Mixed bed polishers
- UV sterilization systems
- Membrane filtration
- Point-of-use filtration
Key System Advantages
1. Maximum Purity Assurance
- Consistent 18 MΩ.cm output
- Multiple purification barriers
- Real-time quality monitoring
- Automated control systems
2. Operational Efficiency
- Continuous 24/7 operation
- Low energy consumption
- Minimal chemical usage
- Reduced wastewater
3. Reliability & Safety
- Redundant system design
- Automatic fail-safe protection
- Comprehensive monitoring
- Certified components
4. Cost Effectiveness
- Lower operating costs
- Reduced maintenance
- Long component lifespan
- Energy recovery systems
5. Compliance & Certification
- SEMI standards compliance
- ISO 9001 certification
- CE and UL certifications
- Environmental compliance

Industry Applications
Semiconductor Manufacturing:
- Silicon wafer production
- Chip fabrication facilities
- Integrated circuit manufacturing
- MEMS device production
Related Industries:
- Flat panel display manufacturing
- Solar cell production
- LED chip fabrication
- Microelectronics research
Selection Guide
Choosing the Right System:
For New Fabs:
- RO + EDI + polishing mixed bed
- Full automation capability
- Expansion-ready design
- Latest technology
For Existing Facilities:
- System upgrade options
- Retrofitting services
- Capacity expansion
- Technology migration
For Budget Projects:
- Traditional mixed bed systems
- Proven technology
- Lower initial investment
- Reliable performance
Service & Support
Professional Services:
- Facility assessment
- System design engineering
- Installation supervision
- Validation and commissioning
Technical Support:
- 24/7 remote monitoring
- Preventive maintenance
- Spare parts supply
- Performance optimization



